Superconducting Through-Silicon Vias for Quantum Integrated Circuits

2017/08/07 by Vahidpour, Mehrnoosh, O'Brien, William, Whyland, Jon Tyler +12
#Applied Physics (physics.app-ph) #FOS: Physical sciences #Quantum Physics (quant-ph)

paper · doi:10.48550/arxiv.1708.02226

Abstract

We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to-via resistance below the critical temperature of aluminum.

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