2012/08/06 by Bosco Emmanuel, Emmanuel, Bosco
Engineering · Physics and Astronomy · #FOS: Physical sciences #Integrated Circuits and Semiconductor Failure Analysis #Materials Science (cond-mat.mtrl-sci) #Semiconductor materials and devices #Surface and Thin Film Phenomena #cond-mat.mtrl-sci
paper · pdf · doi:10.48550/arxiv.1208.1096
12 pages and 1 Figure
arxiv created 2012/08/06 · openalex publication_date 2012/08/06 · arxiv updated 2012/08/07 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
A variant of the point defect model originally enunciated by Macdonald and co-workers is advanced and its theoretical implications for the steady state current density, barrier layer thickness and the concentration of metal vacancy at the metal/film interface are deduced. The differences between the original point defect model and the present variant are also highlighted. The empirical parameters alpha and beta in the original point defect model are replaced with two physical parameters Rcont and Rhof which represent respectively the electronic contact resistance at the metal/film interface and the electronic resistivity of the oxide film. The present variant correctly describes the annihilation of the metal vacancies at the metal/film interface and also enforces the conservation of particle and defect volumes during the solid-state reactions leading to the natural inclusion of the famous Pilling-Bedsworth ratio RPB into the model. Diagnostics which help to check the model predictions with experiments are given. Use of this variant to describe stress-induced failure of the barrier oxide leading to pitting is also discussed.