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A Via-less Fully Screen-Printed Reconfigurable Intelligent Surface for 5G Millimeter Wave Communication

2023/02/07 by Yang, Yiming, Wang, Ruiqi, Vaseem, Mohammad +2 · 1 citation
#78-06 #FOS: Electrical engineering #Signal Processing (eess.SP) #electronic engineering #information engineering

paper · doi:10.48550/arxiv.2302.03424

Abstract

In this paper, we propose a via-less fully screen-printed reconfigurable intelligent surface which can establish a second line-of-sight communication from 23.5GHz to 29.5GHz. By serially connecting the H shaped resonator along the H field of the incident wave, we minimize the effect of the biasing lines and make a via-less design, which reduces the fabrication difficulty and cost. The unit-cell simulation of the array with screen-printed VO2 switches shows a 215° to 160° phase shift difference between the ON and OFF states within bandwidth. During the field testing of the ideal arrays, we verify that the array can redirect the 45° incident wave to 0° reflection with a signal enhancement of at least 10 dB as compared to the array which has all unit cells in the OFF condition.

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