An Extended Analytic Model for the Heating of Bondwires

2017/09/28 by Duque, David, Gotthans, Tomas, Gillon, Renaud +1
#78A30 #80A20 #94C12 #B.3.4 #Computational Engineering #FOS: Computer and information sciences #Finance #and Science (cs.CE)

paper · doi:10.48550/arxiv.1709.10069

Abstract

We present an extended analytic formula for the calculation of the temperature profile along a bondwire embedded in a package. The resulting closed formula is built by coupling the heat transfer equations of the bondwire and the surrounding moulding compound by means of auxiliary variables that stem from an ad-hoc linearisation and mediate the wire-mould thermal interaction. The model, which corrects typical simplifications in previously introduced analytic models, is also optimised against carefully taken experimental samples representing fusing events of bondwires within real packages.

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