2017/05/20 by Leonid Yavits, Yavits, Leonid, Amir Morad +3
Computer Science · Engineering · #3D IC and TSV technologies #FOS: Computer and information sciences #Hardware Architecture (cs.AR) #Interconnection Networks and Systems #Parallel Computing and Optimization Techniques #cs.AR
paper · pdf · doi:10.48550/arxiv.1705.07280
arxiv created 2017/05/20 · openalex publication_date 2017/05/20 · arxiv updated 2017/05/23 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors (CMP) from Amdahl law perspective. We find that 3D CMP may reach its thermal limit before reaching its maximum power. We show that a high level of parallelism may lead to high peak temperatures even in small scale 3D CMPs, thus limiting 3D CMP scalability and calling for different, in-memory computing architectures.