Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers

2006/04/28 by Jun Akedo · 25 citations
Engineering · Materials Science · #High-Temperature Coating Behaviors #Advanced ceramic materials synthesis #Particle Dynamics in Fluid Flows

paper · doi:10.1111/j.1551-2916.2006.01030.x

Abstract

A novel method for depositing ceramic thick films by aerosol deposition (AD) is presented. Submicron ceramics particles are accelerated by gas flow up to 100–500 m/s and then impacted on a substrate, to form a dense, uniform and hard ceramic layer at room temperature. However, actual deposition mechanism has not been clarified yet. To clarify densification mechanism during AD, a mixed aerosol of α‐Al 2 O 3 and Pb(Zr, Ti)O 3 powder was deposited to form a composite layer in this study. The cross‐section of the layer was observed by HR‐TEM to investigate the densification and bonding mechanism of ceramic particles. As a result, a plastic deformation of starting ceramic particles at room temperature was observed.

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