Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard

2013/07/10 by Bibudha Parasar, Gao Wen Jing, Parasar, Bibudha +17
Physics and Astronomy · #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #cond-mat.mtrl-sci

paper · pdf · doi:10.48550/arxiv.1307.2671

24 pages, 10 figures

arxiv created 2013/07/10 · arxiv updated 2013/07/11

Abstract

A discarded motherboard based eco-friendly copper catalyst has been programmed to replace the industrially used tin based catalyst DBTDL. The catalyst has been characterized by UV-Vis spectroscopy, FT-IR and TEM. Using the catalyst reaction conditions is optimized and under the optimized condition, both polyurethane and polyurethane foam are prepared, thus proving the generality of the catalyst to be used in industries. A possible mechanism has also been proposed.

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