The development of grain structure during growth of metallic films

1984/05/01 by C.R.M. Grovenor, H.T.G. Hentzell, H. T. G. Hentzell +2 · 5 citations
Engineering · Materials Science · #Metal and Thin Film Mechanics #Copper Interconnects and Reliability #Microstructure and mechanical properties

paper · doi:10.1016/0001-6160(84)90150-0

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