Timing resolution performance of Timepix4 bump-bonded assemblies

2024/04/23 by Bolzonella, Riccardo, Alozy, Jerome Alexandre, Ballabriga, Rafael +15 · 1 citation
#FOS: Physical sciences #Instrumentation and Detectors (physics.ins-det)

paper · doi:10.48550/arxiv.2404.15499

Abstract

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a 100 μ\textrmm thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to 107 \textrmps r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached 33 \textrmps r.m.s. exploiting oversampling of the timing information over several pixels.

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