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Directional Thermal Emission Across Both Polarizations in Planar Photonic Architectures

2025/05/06 by David E. Abraham, D. F. Cui, Abraham, David E. +12
Engineering · Materials Science · Physics and Astronomy · #Applied Physics (physics.app-ph) #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #Metamaterials and Metasurfaces Applications #Photonic Crystals and Applications #Thermal Radiation and Cooling Technologies

paper · pdf · doi:10.48550/arxiv.2505.03905

openalex publication_date 2025/05/06 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28

Abstract

Directional and spectral control of thermal emission is essential for applications in energy conversion, imaging, and sensing. Existing planar, lithography-free epsilon-near-zero (ENZ) films only support transverse-magnetic (TM) control of thermal emission via the Berreman mode and cannot address transverse-electric (TE) waves due to the absence of natural optical magnetism over optical and infrared wavelengths Here, we introduce a hyperbolic metamaterial comprising alternating layers of degenerately-doped and intrinsic InAs that exhibits an epsilon-and-mu-near-zero (EMNZ) response, enabling dual-polarized, directionally and spectrally selective thermal emission. We first theoretically demonstrate that a mu-near-zero (MNZ) film on a perfect magnetic conductor supports a magnetic Berreman mode, absorbing TE-polarized radiation in analogy to the conventional Berreman mode supported in TM polarization. Using genetic and gradient-descent optimization, we design a dual-polarized emitter with independently tunable spectral peaks and emission angles. Parameter retrieval via homogenization confirms simultaneous EMNZ points at the target wavelengths and angles. Finally, experimental measurement of a sample fabricated via molecular beam epitaxy exhibits high absorptivity peaks for both polarizations in close agreement with simulations. This work realizes lithography-free, dual-polarized, spectrally and directionally selective emitters, offering a versatile platform for advanced infrared thermal management and device integration.

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