2024/01/04 by Donald Witt, Witt, Donald, Lukas Chrostowski +3 · 1 citation
Engineering · #Advanced Fiber Optic Sensors #Advanced MEMS and NEMS Technologies #FOS: Physical sciences #Optics (physics.optics) #Photonic and Optical Devices #Quantum Physics (quant-ph)
paper · pdf · doi:10.48550/arxiv.2401.02068
openalex publication_date 2024/01/04 · openalex created_date 2024/01/10 · openalex updated_date 2026/07/28
A new cryogenic packaging methodology that is widely applicable to packaging any integrated photonics circuit for operation at both room temperature and cryogenic temperature is reported. The method requires only equipment and techniques available in any integrated optics lab and works on standard integrated photonic chips. Our methodology is then used to enable the measurement of a single photon pair sourced based on a silicon ring resonator at cryogenic temperatures. When operating at 5.9 K, this source is measured to have a peak pair generation rate 183 times greater then at room temperature in the CL-band.