Michael Nolan

1. Control of Cu morphology on TaN barrier and combined Ru-TaN barrier/liner substrates for nanoscale interconnects from atomistic kinetic Monte Carlo simulations
   2024/10/08 by Samuel Aldana, Aldana, Samuel, Cara‐Lena Nies +3 · 1 citation
   Engineering · Materials Science · #Chemical Physics (physics.chem-ph) #Computational Physics (physics.comp-ph) #Copper Interconnects and Reliability #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #Metal and Thin Film Mechanics #Semiconductor materials and devices